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MF34
MF34
Fast Recovery Diode
Replaces March 1998 version, DS4624-2.1 DS4624-3.0 January 2000
APPLICATIONS
s Inverse, Parallel Or Series Connected Diode s Power Supplies s High Frequency Applications
KEY PARAMETERS VRRM 1600V IF(AV) 40A IFSM 400A Qr 25C trr 0.25ns
FEATURES
s Glass Passivation s High Voltage Capability s Fast Recovery Characteristics
VOLTAGE RATINGS
Type Number Repetitive Peak Reverse Voltage VRRM V 1600 1400 1200 1000 800 Conditions
MF34 - 1600 MF34 -1400 MF34 - 1200 MF34 -1000 MF34 - 800
VRSM = VRRM +100V
Lower voltage grades available. For stud anode add suffix 'R' to type number. e.g. MF34-1600R.
Outline type code: DO5. See Package Details for further information.
CURRENT RATINGS
Symbol IF(AV) IF(RMS) IF Parameter Mean forward current RMS value Continuous (direct) forward current Conditions Half sine wave resistive load, Tcase = 65oC Tcase = 65oC Tcase = 65oC Max. 40 63 50 Units A A A
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MF34
SURGE RATINGS
Symbol IFSM I2t Parameter Surge (non-repetitive) forward current I2t for fusing Conditions 10ms half sine; with VRRM 10V, Tj = 125oC 10ms half sine; Tj = 125oC Max. 400 800 Units A A2s
THERMAL AND MECHANICAL DATA
Symbol Rth(j-c) Rth(c-h) Parameter Thermal resistance - junction to case Thermal resistance - case to heatsink dc Mounting torque 3.5Nm with mounting compound Forward (conducting) Tvj Virtual junction temperature Reverse (blocking) Tstg Storage temperature range Mounting torque -55 3.5 125 125 4.0
o
Conditions
Min. -
Max. 0.8 0.2 125
Units
o
C/W
o
C/W
o
C C
C Nm
CHARACTERISTICS
Symbol VFM IRM trr QR VTO rT Forward voltage Peak reverse current Reverse recovery time Recovered charge Threshold voltage Slope resistance Parameter Conditions At 120A peak, Tcase = 25 C At VRRM, Tcase = 100oC IF = 1A, diRR/dt = 25A/s, Tcase = 25C, VR = 100V IF = 50A, diRR/dt = 50A/s, Tcase = 25C, VR = 100V At Tvj = 125 C At Tvj = 125 C
o o o
Typ. -
Max. 2.0 5 250 25 1.2 7.0
Units V mA
ns
C V m
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MF34
CURVES
200
Measured under pulse conditions Tj = 25C
Instantaneous forward current - (A)
150
Tj = 125C 100
50
0
0
1.0 2.0 3.0 Instantaneous forward voltage - (V)
Fig.1 Maximum (limit) forward characteristics
Peak half sinewave forward current - (A)
400
Thermal impedance - C/W
Tcase = 125C VR = VRRM
1.00 d.c. 0.75
350
300
0.50
250
0.25
200
1
2
3 45
10
50
0 0.001
0.01
Cycles at 50Hz Duration
Fig.2 Surge (non-repetitive) forward current vs time
0.1 Time - (s)
1.0
10
Fig.3 Maximum transient thermal impedance
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MF34
500
Tcase = 65
Peak current - (A)
100
50 10 00 0 50 00 25 00 10 00 50 0 30 0 H 10 z 0
10 10
100 1000 Pulse width - (s)
Fig.4 Frequency curves - square waveform
10000
500
Tcase = 85
Peak current - (A)
100
50 10 00 0 50 00 25 00 10 00 50 0 30 0
H 10 z 0
10 10
100 1000 Pulse width - (s)
Fig.5 Frequency curves - square waveform
10000
500 0.05
Peak current - (A)
0.1
0.2
0.5
1.0
2.0J
100
10 10
100 1000 Pulse width - (s)
Fig.6 Energy per pulse - square waveform
10000
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MF34
500
Tcase = 65
Peak current - (A)
100
10 00 0 50 00 25 00 10 00 50 0 30 0
50 H 10 z 0
10 10
100 1000 Pulse width - (s)
Fig.7 Frequency curves - sine waveform
10000
500
Tcase = 85
Peak current - (A)
100
10 00 50 25 00 10 00 50 30 50 H 10 z 0
0
00
0
0
10 10
100 1000 Pulse width - (s)
Fig.8 Frequency curves - sine waveform
10000
500 0.05 0.1 0.2 0.5 1.0 2.0J
Peak current - (A)
100
10 10
100 1000 Pulse width - (s)
Fig.9 Energy per pulse - sine waveform
10000
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MF34
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
Hex. 17.35mm AF max
O4.0
23
11.5
Thread 1/4 in 28 UNF 2A Weight: 20g
Package outline type code: DO5
ASSOCIATED PUBLICATIONS
Title Calculating the junction temperature or power semiconductors Thyristor and diode measurement with a multi-meter Use of V , r on-state characteristic
TO T
Application Note Number AN4506 AN4853 AN5001
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MF34
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of `T' 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it's own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2000 Publication No. DS4624-3 Issue No. 3.0 January 2000 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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